发明名称 |
High pressure wafer-less auto clean for etch applications |
摘要 |
A method for cleaning a processing chamber is provided. The method initiates with introducing a fluorine containing gaseous mixture into a processing chamber. Then, a plasma is created from the fluorine containing gaseous mixture in the processing chamber. Next, a chamber pressure is established that corresponds to a threshold ion energy in which ions of the plasma clean inner surfaces of the processing chamber without leaving a residue. A method for substantially eliminating residual aluminum fluoride particles deposited by an in-situ cleaning process for a semiconductor processing chamber and a plasma processing system for executing an in-situ cleaning process are also provided.
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申请公布号 |
US2003005943(A1) |
申请公布日期 |
2003.01.09 |
申请号 |
US20020138288 |
申请日期 |
2002.05.02 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
SINGH HARMEET;DAUGHERTY JOHN E.;ULLAL SAURABH J. |
分类号 |
B08B7/00;H01J37/32;(IPC1-7):B08B6/00;C25F1/00 |
主分类号 |
B08B7/00 |
代理机构 |
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