| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a laser beam machining device which is capable of cutting an object for machining without the occurrence of melting and a crack deviating from a planned cutting line on the surface of the object for machining. SOLUTION: This laser beam machining device 100 has a laser beam source 101 which emits a laser beam L below 1μs in pulse width, means 401 which adjusts the power of the laser beam based on input, lens selecting means 405 which is capable of selecting a condenser lens 105 which condenses the laser beam in such a manner that the peak power density of the condensing point P of the laser beam attains >=1×10<8> (W/cm<2> ), means 113 which aligns the condensing point to the inside of the object 1 for machining, means 109 and 111 which move the condensing point along the planned cutting line, 5, means 127 which previously stores the power of the laser beam and the correlativity between set of the numerical apertures of an optical system including the condenser lens and the size of a reforming spot and selects the size of the reforming spot formed by the input value and means 129 which displays this size.</p> |
