Method of polishing a substrate

摘要

A method of polishing a substrate by providing a polishing slurry comprising water and silica particles, wherein the average size (by number) of the silica particles is less than 30 nm, providing a polymeric polishing pad substantially free of bound abrasive particles and having a polishing surface comprising a multiplicity of cavities, and polishing the surface of the substrate by contacting the polishing slurry and the polishing pad with the substrate and moving the polishing pad relative to the substrate.