发明名称 IC SOCKET
摘要 PROBLEM TO BE SOLVED: To enable to position by biasing an IC package with a leaf spring before a latch lever fitted with the leaf spring completes to close. SOLUTION: The IC socket of an open top type having a pinch-in contact forming an electric connection by insertion of an IC package is provided with a biasing mechanism for positioning the IC package by biasing it from one direction.
申请公布号 JP2002367747(A) 申请公布日期 2002.12.20
申请号 JP20010171133 申请日期 2001.06.06
申请人 YAMAICHI ELECTRONICS CO LTD 发明人 OIKAWA TAKAHIRO;KONO MASAHIRO
分类号 H01R33/76;H01L23/32;H05K7/10;(IPC1-7):H01R33/76 主分类号 H01R33/76
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