发明名称 |
Electroless copper plating solution and high-frequency electronic component |
摘要 |
An electroless copper plating solution which can ensure superior adhesion of a copper plating film to a flat ceramic surface having low roughness and which can form a high-frequency electronic component having superior high-frequency conductivity and a high Q value is provided. Also provided is a high frequency electronic component formed by using this electroless copper plating solution. The electroless copper plating solution of contains copper ions, nickel ions, formaldehyde or a derivative thereof, and tartaric acid or a salt thereof. The ratio of the content of the nickel ions to that of the copper ions on a molar basis is in the range of about 0.0001 to 0.015.
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申请公布号 |
US2002192364(A1) |
申请公布日期 |
2002.12.19 |
申请号 |
US20020120510 |
申请日期 |
2002.04.12 |
申请人 |
KANOH OSAMU;YOSHIDA KENJI |
发明人 |
KANOH OSAMU;YOSHIDA KENJI |
分类号 |
C23C18/40;C23C18/48;H01B1/02;H01G4/008;H01P7/04;H01P7/10;H01P11/00;(IPC1-7):B05D5/12 |
主分类号 |
C23C18/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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