发明名称 |
Electronic unit manufacturing apparatus and method |
摘要 |
An electronic unit manufacturing apparatus includes: a cream solder printer for printing cream solder on one side of a printed-circuit board; a chip placement machine for placing a plane-mounted part on the printed-circuit board on which the cream solder is printed; a first reflow furnace for fixedly securing the plane-mounted part to the printed-circuit board; a solder application machine for applying a larger amount of cream solder than that printed by the cream solder printer in the vicinity of holes made in the one side of the printed-circuit board; and a second reflow furnace for inserting pins of a deformed part into the holes made in the printed-circuit board from an opposite side thereof and fixedly securing the pins of the deformed part to the printed-circuit board, wherein in the second reflow furnace. In the second reflow furnace, temperature on the opposite side of the printed-circuit board is set lower than temperature on the one side thereof.
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申请公布号 |
US6493928(B1) |
申请公布日期 |
2002.12.17 |
申请号 |
US19980071607 |
申请日期 |
1998.05.01 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
SHINBO TOSHIHARU;TSUYAMA KAZUHIKO;MIKI TOSHINOBU |
分类号 |
H05K3/34;(IPC1-7):B23P19/00 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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