| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent surplus solder at soldering from flowing out to the side of a semiconductor substrate. SOLUTION: A cathode terminal conductor 11 is provided with a hole 15 for solder release so as to prevent surplus fused solder from flowing out to the side of the semiconductor substrate 5 when soldering a temperature compensating board 6B and the cathode terminal conductor 11, and the surplus solder is sucked up to the topside of the cathode terminal conductor 11 by capillarity.</p> |
