| 摘要 |
<p>The sputtering target (10) is design for uniformly sputtering a material on a substrate. The target (1) contains a base region (12), disk-shaped center region (14), outer ring-shaped region (16), outer edge region (18) and outer edge (20). Tapered regions (22) serve to level-out sputtering in areas prone to non-uniform sputtering. A flange (26) containing threaded openings (28) facilitates fastening of the sputtering target (10) with a sputtering chamber. The outer ring-shaped region (16) has a projection height for extending the life of the sputtering target (10). The center region (14) has a projection height less than the projection height of the outer ring-shaped region (16) for increasing the sputtering deposition rate on the substrate adjacent the center region (14).</p> |
