SEMICONDUCTOR FABRICATION APPARATUS HAVING SUPPORT PLATE WITHIN DEVICE INSTALLATION REGION

摘要

PURPOSE: A semiconductor fabrication apparatus having a support plate within a device installation region is provided to remove a dead space between the semiconductor fabrication apparatuses by installing the support plate within the semiconductor fabrication apparatus located within the device installation region. CONSTITUTION: A semiconductor fabrication apparatus(200) is formed with a support plate(210), a process chamber(240), and a transfer device. The transfer device has the first transfer device(220) and the second transfer device(230). The semiconductor fabrication apparatus(200) is located within a device installation region which is divided by a partition(80). The support plate(210) is located within the semiconductor fabrication apparatus(200). A reception vessel(290) is loaded on the semiconductor fabrication apparatus(200) by an AGV(Automated Guided Vehicle) robot(70). A wafer of the reception vessel(290) is transferred to the second transfer device(230) by the first transfer device(220). The second transfer device(230) transfers the wafer to the process chamber(240). The process chamber(240) processes the wafer.