| 摘要 |
PROBLEM TO BE SOLVED: To provide an equipment and a method for reworking components which enable to heat efficiently the only component to be reworked without applying excessive heat load to the other components while suppressing a heat loss of hot air. SOLUTION: A second heating means 21 for heating a bonding section (solder balls) 5a between a substrate 2 and the component 5 to be reworked which is mounted on the substrate 2, indirectly from the lower surface side of the substrate 2 can be moved with respect to the substrate 2, with the distance between the second heating means 21 and the substrate 2 being adjustable. The second heating means 21 is provided with a second hot air blowout nozzle 28, and the bonding section 5a is locally heated by the hot air from the second hot air blowout nozzle 28 from the lower surface side of the substrate 2. |
