| 摘要 |
PROBLEM TO BE SOLVED: To provide a novel heat-resistant film for a substrate improved in heat resistance, flame retardancy, dimensional stability an low environmental load properties which have been heretofore deemed as drawbacks of a thermoplastic resin composition when used as an insulting material for a printed wiring board, and a printed wiring board obtained using the same. SOLUTION: The heat-resistant film for a substrate is a film comprising 100 pts.wt. of a thermoplastic resin, and incorporated therewith, at least 20 but less than 50 pts.wt. of a scaly inorganic filler, where the scaly inorganic filler has the following characteristics: (1) The 90% average particle size measured by a laser diffraction grain size distribution method is less than 15μm. (2) The aspect ratio (an average particle size/an average thickness) is at least 35. (3) A decrease in weight measured by the thermobalance method when the temperature is raised from room temperature to 400 deg.C is less than 0.5 wt.%.
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