| 摘要 |
A semiconductor device includes a lower conductive member, a upper conductive member and a conductive wire. The one end of the conductive wire is electrically connected to a semiconductor chip. The lower conductive member is formed on a lead frame. The conductive wire is sandwiched between the lower conductive member and the upper conductive member located thereon and is electrically connected to the lead frame. A connecting portion of the conductive wire connected to the lead frame is sandwiched between the lower and upper conductive members so that the neck portion of the conductive wire can be protected from above.
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