发明名称 |
CATALYST-IMPARTING TREATMENT SOLUTION AND ELECTROLESS PLATING METHOD |
摘要 |
The present invention provides a catalyst-imparting treatment solution and an electroless plating method that can form a protective film of a phosphorus-containing alloy to protect the surface of copper interconnects of an electronic device without forming voids in the copper interconnects. The catalyst-imparting treatment solution, for use in a catalyst-imparting pretreatment before carrying out electroless plating of at least part of an electronic device having an embedded copper-interconnect structure using a hypophosphite as a reducing agent, includes at least one complex compound of a noble metal of Group IB or Group VIII of the Periodic Table. |
申请公布号 |
WO02092877(A2) |
申请公布日期 |
2002.11.21 |
申请号 |
WO2002JP04521 |
申请日期 |
2002.05.09 |
申请人 |
EBARA CORPORATION;INOUE, HIROAKI;NAKAMURA, KENJI;MATSUMOTO, MORIJI |
发明人 |
INOUE, HIROAKI;NAKAMURA, KENJI;MATSUMOTO, MORIJI |
分类号 |
C23C18/16;C23C18/30;H01L21/288;H01L21/768 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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