| 摘要 |
A highly rigid ceramic frame (38) is embedded in a layer of a core member (34). An IC chip (42) is held inside (38a) via an elastic member (40). IC chip 42 arranged inside (38a) will not be greatly deformed even when a strong bending, torsional, or pressing force is applied to the IC card (30). An impact, when exerted on the IC card (30), will not be directly conveyed to the IC chip (42). A coil (44) formed by printing and the like is provided at an upper end face (38b) of the ceramic frame (38). The coil (44) is connected to the IC chip (42) by a wire (46). By forming the IC chip (42), the ceramic frame (38) and the coil (44) integrally in advance, the workability in fabrication is improved. Therefore, a circuit chip mounted card of high reliability and low fabrication cost can be provided.
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