SUBSTRATE HEAT TREATING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide an apparatus for quickly cooling a substrate at a high temperature side. SOLUTION: A shutter plate 26 is disposed between a light incident window 16 of a heat treating furnace 10 and a lamp 20a of a lamp house 20, and the plate 26 is held at a waiting position in heat treatment and moved from the waiting position to a working position at the same time as or just after the feed stop of the lamp after finishing the heat treatment, thereby shutting off remaining heat of the lamp from radiating a wafer W in the heat treating furnace.