发明名称 COMPONENT MOUNTER AND METHOD OF MOUNTING COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a component mounter which enables to shorten the tact time and improve the mounting efficiency by shortening the transportation time for electronic components which are to be mounted. SOLUTION: The component mounter 10 comprises a punch 11 for puncing electronic components 42 from a film carrier 41, and a component transferring device 14 for transferring the electronic components 42 punched from the film carrier 41 by means of the punch 11 from an electronic component receiving position P to an electronic component delivering position H while changing the directions of the electronic components 42. The component transferring device 14 has a nozzle 15 for chucking and holding the electronic component 42 punched by the punch 11. The nozzle 15 is installed on a rotary shaft 18 of a θ-axis driving section 17 via an arm and is so structured as to be rotated around a rotary axis L which deviates from the shaft center. The θ-axis driving section 17 is installed on an XY-axis driving section 19, and the nozzle 15 is moved together with the arm 16 and the θ-axis driving section 17 in parallel with an X-Y plane in the X-Y plane which is vertical to the rotary axis L.
申请公布号 JP2002314294(A) 申请公布日期 2002.10.25
申请号 JP20010112687 申请日期 2001.04.11
申请人 SHIBAURA MECHATRONICS CORP 发明人 UEDA SHUNICHI
分类号 H05K13/04 主分类号 H05K13/04
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