| 摘要 |
PROBLEM TO BE SOLVED: To surely carry out flip-chip bonding between a semiconductor chip and a substrate by means of a projection electrode, even if deformation or the like is generated in a substrate regarding a semiconductor device where a semiconductor chip is subjected to flip-chip bonding to a substrate, and to provide its manufacturing method. SOLUTION: In a semiconductor device, which is constituted by performing flip-chip bonding for a first semiconductor chip 23 on a substrate 22 by using a plurality of stud bumps 25, a plurality of stud bumps 25 are made different in height, to correspond to a clearance distance between the first semiconductor chip 23 and the substrate 22. |
