发明名称 MOISTURE-CURABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a moisture-curable resin composition of which the surface tackiness disappears in a short time as compared with the existing moisture- curable resin composition. SOLUTION: This moisture-curable resin composition is composed of 100 pts.wt. of an organic polymer (a) containing a silyl group and having at its molecular terminal or on its side chain at least one functional group having a silicon atom bound to a hydrolyzable group per molecule and 0.1-20 pts.wt. of a tin compound (b) of a carboxylic acid which is expressed in general formula (1) below (wherein, R<1> , R<2> , R<3> are each a 1-10C hydrocarbon group that may be identical or different) where theαcarbon atom of the carboxylic acid is a tertiary carbon.
申请公布号 JP2002285018(A) 申请公布日期 2002.10.03
申请号 JP20010088406 申请日期 2001.03.26
申请人 NITTO KASEI CO LTD 发明人 NAKAMURA HIROMASA;MURANAKA TAKAYUKI;TABUCHI HITOSHI
分类号 C09K3/10;C08K5/098;C08L101/10;C09J109/00;C09J157/06;C09J171/00;C09J201/10;(IPC1-7):C08L101/10 主分类号 C09K3/10
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