| 摘要 |
<p>A method of fabricating a multilayer printed circuit board, comprises alternately stacking on a template (1) having at least two vertical alignment pins (2), predefined printed circuit sub-boards (3) and pre-impregnated sheets (12) precursors of dielectric layers of reinforced resin between said sub-boards, all provided with alignment holes (14, 5), binding together the components of the assembled stack, lifting the stack off the alignment pins (2), transferring it between the platens of a press and hot pressing it causing polymerization of the resin of said pre-impregnated sheets. The method consists in defining at least a pair of soldering pads (7) with hole therethrough at certain positions relative to said alignment holes (14, 5) on both faces of each of said sub-boards (3) except the lowermost sub-board on which blind pads (6) are defined on at least its upper face; indenting or perforating each pre-impregnated sheet (12) such not to overlap said pads (6, 7) and soldering each newly stacked sub-board (3) to the previously stacked underlying sub-board (3) through the respective pads (7) with a hole therethrough. The machine employs a template (1) having at least two vertical alignment pins (2); a least two electric soldering irons (16), soldering each sub-board (3) just stacked to the previously stacked underlying one through welding pads (7) having a hole therethrough and has means (18) for moving each one of said soldering irons along three orthogonal axis onto a respective one of said pads (7) with a hole therethrough to make the soldering, and off and away from the stack when the soldering have been done.</p> |
