| 摘要 |
PROBLEM TO BE SOLVED: To provide a double-sided circuit board for lamination, that is suited for the structure of a high-density multilayer printed-wiring board in an IVH structure and can surely and electrically connect via holes that are adjacent in the above and below directions, and to provide a multilayer printed-wiring board using the double-sided circuit board for lamination, and its manufacturing method. SOLUTION: In the double-sided circuit board for lamination, a double-sided copper-clad glass cloth resin laminated sheet is used, a blind via is made by laser beams, a via post by electrolytic plating is formed in the via, and then a conductor circuit is formed. In the multilayer printed-wiring board, a prepreg, having a via hole that is filled with a conductive substance, is inserted and laminated between a plurality of double-sided multilayer circuit boards for adhesion and interlayer connection, thus making connection to the conductor circuits in the upper/lower double-sided multilayer circuit board. |
