发明名称 Molded assembly with heating element captured therein
摘要 A heated element assembly and method of manufacturing heated element assemblies is provided. The heated element assembly including a first and second molded sections shaped to mate with each other is provided. A resistance heating element is secured between the first and second molded sections by an interference fit. The resistance heating element includes a piercable supporting substrate and a resistance wire sewn thereon. The resistance wire is disposed in a predetermined circuit path which is substantially encompassed by the first and second molded sections. The resistance heating element is easily fixed in a position between the first and second molded sections and is capable of providing heat on vertical, horizontal and contoured surfaces.
申请公布号 US6433317(B1) 申请公布日期 2002.08.13
申请号 US20000544873 申请日期 2000.04.07
申请人 WATLOW POLYMER TECHNOLOGIES 发明人 ARX THEODORE VON;LAKEN KEITH;SCHLESSELMAN JOHN W.;PAPENFUSS RONALD E.
分类号 A47G19/22;A47J27/00;A47J27/21;A47J36/24;H05B3/00;H05B3/18;H05B3/26;H05B3/28;(IPC1-7):H05B3/68;H05B3/44 主分类号 A47G19/22
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