发明名称 |
Molded assembly with heating element captured therein |
摘要 |
A heated element assembly and method of manufacturing heated element assemblies is provided. The heated element assembly including a first and second molded sections shaped to mate with each other is provided. A resistance heating element is secured between the first and second molded sections by an interference fit. The resistance heating element includes a piercable supporting substrate and a resistance wire sewn thereon. The resistance wire is disposed in a predetermined circuit path which is substantially encompassed by the first and second molded sections. The resistance heating element is easily fixed in a position between the first and second molded sections and is capable of providing heat on vertical, horizontal and contoured surfaces.
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申请公布号 |
US6433317(B1) |
申请公布日期 |
2002.08.13 |
申请号 |
US20000544873 |
申请日期 |
2000.04.07 |
申请人 |
WATLOW POLYMER TECHNOLOGIES |
发明人 |
ARX THEODORE VON;LAKEN KEITH;SCHLESSELMAN JOHN W.;PAPENFUSS RONALD E. |
分类号 |
A47G19/22;A47J27/00;A47J27/21;A47J36/24;H05B3/00;H05B3/18;H05B3/26;H05B3/28;(IPC1-7):H05B3/68;H05B3/44 |
主分类号 |
A47G19/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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