发明名称 BONDING DEVICE
摘要 PURPOSE:To ensure the bonding jobs at a high speed and with high accuracy by adding the parameter control channels exclusive for axes to the servo control parts of each axis via a bonding sequence control part. CONSTITUTION:A bonding sequence control part 9 produces the X-Z axis position command signals (d), (h) and (l) decomposed into three axes X-Z respectively from the loci of a space where a capillary moves. At the same time, a timing signal P is supplied to a parameter control part 10 from the part 9 and the parameter signals (m), (n) and (o) for each axis are sent to the servo control parts 3, 6 and 8 for each axis respectively. A bonding head 1 is driven by a Z axis drive signal (a) and supplies the information showing the state of the head 1, e.g., the moving speed of the head 1, etc., to the Z axis servo control part 3 as a Z axis feedback signal. In the same way, the feedback signals (g) and (k) are supplied for Y and X axes respectively. Then the parts 3-8 replace the constants of servo systems right after the input of new parameter signals (m)-(o) and start the servo actions with new parameters.
申请公布号 JPH01120602(A) 申请公布日期 1989.05.12
申请号 JP19870279723 申请日期 1987.11.04
申请人 NEC CORP 发明人 KONISHI YUKIHIKO
分类号 G05B13/02;G05B13/00;G05B19/18;G05B19/19;G05D3/12;H01L21/60 主分类号 G05B13/02
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