Chip card manufacturing process

摘要

To produce a chip card, the coil carrier layer is prepared, with the coil (10A) and the coil connections. A prepared covering layer is placed over the carrier, on the coil connection side, with openings matching the positions of the coil connections. A further layer is placed over the covering layer, to give thickness compensation, and further layers to compensate for thickness can be on the side of the carrier away from the coil connections. The orientation of the layers are set accurately to bring the openings and coil connections into alignment with each other. The overlaid layers are placed in a lamination press, to be bonded together by heat and pressure, and the projecting coil connections are pressed back into the plastics mass in the openings of the covering layer. The laminated card is taken from the laminating press, and an opening is milled to hold the chip modules (3), and the coil connections are left free. The chip module (3) is inserted into the holder opening of the card body, and the chip module and coil connections are electrically linked together. Also claimed is a chip card with a coil carrier layer for a coil (10A) and coil connections. The carrier layer has humped projections at least partially and at the coil connections, to give a positive fit with the overlaid covering layer. The covering layer is in turn covered with a layer to give thickness compensation. The chip module (3), with an integrated circuit within a recess in the card body, has contacts to be linked electrically to the coil connections.