| 摘要 |
An LSI chip has first electrodes. A chip carrier has a board, second electrodes arranged on a first surface of the board, third electrodes arranged on a second surface of the board, and wires connecting second electrodes to third electrode each other. Bumps combine the first electrodes of the LSI chip with the second electrodes of the chip carrier each other. Resin fills a space between a main surface of the LSI chip and a first surface of the board, so as to fix the bumps to each other. Ball electrodes are combined with third electrodes of the chip carrier. |
