| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC socket with which each part and overall structure is simplified and assembly work is easy with reduced cost, and the preparation material depending on the size of IC, shape of the lead terminal and type of pitch can be reduced, and, further the attachment and removal of IC is easy, thus enabling to prevent contact failures. SOLUTION: In the IC socket, an IC-mounting table 110 on which plural kinds of ICs of different sizes are mounted and positioned with the lead terminal upward, is installed and fixed to the socket substrate 120 and an IC-mounting/ installation base part 100 which is arranged and fixed with plural connection/ holding pins 130 surrounding it is installed. The pitch-converting FPC 220, of which one end is connected to the plural contact-connecting pattern wiring 212, that extend in parallel with the same pitch as that of the IC lead terminal on the insulating substrate and the other end is connected to and held by the connection/holding pins 130 are installed, and a pressure-contacting member 300 that pressure welds the contact-connecting pattern wiring 212 with the IC lead terminal is provided.
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