METHOD FOR IMPARTING CATALYST FOR ELECTROLESS PLATING

摘要

PROBLEM TO BE SOLVED: To provide a method for imparting a catalyst for electroless plating by which a dense electroless plating film having excellent adhesion and minimal plating defects such as traces of gas and pits can be formed. SOLUTION: In this method for imparting a catalyst for electroless plating, a nonconducting material as a material to be plated is immersed in an aqueous solution containing a ruthenium compound and then immersed in an aqueous solution containing a reducing agent.