| 摘要 |
<p>A method of fabricating conducting through-connections in a substrate, and a substrate equipped with such connections. The method of fabricating conducting through-connections between the front face and the rear face of a substrate hollows into the substrate, from the rear-face side, cavities having a depth and a cross-section that are defined so as to delimit studs of defined cross-section, which are intended to provide for electrical conduction between the front and rear faces, and filling in the cavities with a dielectric material. The substrate is equipped with conducting through-connections between its front face and its rear face. The conducting connections are provided by way of studs delimited by cavities filled in with a dielectric material. Such a method and substrate may find application, in particular, to substrates used for the fabrication of microsensors.</p> |
