首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
SYSTEM FOR DETECTING LEAKAGE OF GAS
摘要
申请公布号
EP0813048(B1)
申请公布日期
2002.05.29
申请号
EP19960943304
申请日期
1996.12.26
申请人
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
发明人
NAMBA, MITSUO;ASAYAMA, TSUNEO;TAKAHASHI, SATOSHI
分类号
G01F1/00;G01M3/28;G08B21/00;G08B21/16;G08B25/00;(IPC1-7):G01M3/00;G01F3/22
主分类号
G01F1/00
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Power Semiconductor Device with Embedded Field Electrodes
SEMICONDUCTOR DEVICES WITH CONTACT STRUCTURES AND A GATE STRUCTURE POSITIONED IN TRENCHES FORMED IN A LAYER OF MATERIAL
FIN-TYPE FIELD EFFECT TRANSISTOR AND MANUFACTURING METHOD THEREOF
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
FULLY-PRINTED CARBON NANOTUBE THIN FILM TRANSISTOR CIRCUITS FOR ORGANIC LIGHT EMITTING DIODE
IMAGE PICKUP APPARATUS AND IMAGE PICKUP SYSTEM
Image Sensor Having Enhanced Backside Illumination Quantum Efficiency
Varied STI Liners for Isolation Structures in Image Sensing Devices
SEMICONDUCTOR DEVICE
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
METHOD FOR FORMING A SPLIT-GATE DEVICE
FINFETS WITH LOW SOURCE/DRAIN CONTACT RESISTANCE
COMPOUND SEMICONDUCTOR INTEGRATED CIRCUIT WITH THREE-DIMENSIONALLY FORMED COMPONENTS
Bonding Structure for Stacked Semiconductor Devices
Semiconductor Device and Method of Forming Substrate Having Conductive Columns
STRUCTURE FOR ALUMINUM PAD METAL UNDER BALL BOND
DIE INTERCONNECT
ELECTRICAL INTERCONNECTION STRUCTURE AND FABRICATION METHOD THEREOF
SEMICONDUCTOR SOCKET WITH DIRECT SELECTIVE METALIZATION
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE