| 摘要 |
PROBLEM TO BE SOLVED: To reduce the dripping resist liquid applied to a semiconductor substrate in a manufacturing method for a semiconductor inspection apparatus. SOLUTION: The manufacturing method for the semiconductor inspection apparatus is provided with a process wherein a film is formed on the surface of a silicon substrate 1, and a plurality of probes are formed by photolithography; a process wherein, after the film has been formed, a beam or a disphragm is formed at each probe by a process similar to the process; a process wherein, after the film has been removed, a through hole is formed by a process similar to the process; and a process wherein, after the film has been removed, an insulating film is formed on the surface of the silicon substrate, a metal film is formed on the surface of the insulating film so as to be patterned by photolithography, and wiring is then formed. Before the process in which the metal film is patterned by photolithography, an electrocoating resist 6 is applied to the silicon substrate by using a wafer holder 3 for resist coating which holds only both side ends of the silicon substrate, and the metal film is then patterned by photolithography.
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