| 摘要 |
A semiconductor component includes a substrate, bonding pads on the substrate, and terminal contacts bonded to the bonding pads. Exemplary components include semiconductor packages, semiconductor wafers and semiconductor dice. Exemplary terminal contacts include contact balls, contact bumps and contact columns. In each case, the terminal contacts can be arranged in a dense array, such as a ball grid array (BGA), or fine ball grid array (FBGA). The component also includes patterns of primary conductors on the substrate in electrical communication with the bonding pads and with the terminal contacts. Selected terminal contacts, particularly those most likely to experience fatigue failure due to thermal loads, are in electrical communication with the primary conductors and also with one or more secondary conductors. The secondary conductors are configured to provide alternate electrical paths for the selected terminal contacts should damage occur to the primary conductors. In addition, the secondary conductors are configured to rigidify the bonding pads and terminal contacts so that separation from the substrate is less likely to occur.
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