发明名称 METALLIC MATERIAL FOR ELECTRONIC PART, ELECTRONIC PART, ELECTRONIC EQUIPMENT, MACHINING METHOD FOR METALLIC MATERIAL, AND ELECTRONIC OPTICAL PART
摘要 PROBLEM TO BE SOLVED: To provide a metallic material for an electronic part having a low resistivity when compared with a conventional material and excellent machining property and being stable, provide the electronic part, electronic equipment, and an electronic optical part using the metallic material, and provide a machining method for the metallic material. SOLUTION: This metallic material for the electronic part is made of alloy containing Au of 0.1 wt.% or more and 10 wt.% or less and one kind or a plurality of elements selected from a group of Cu, Al, Ti, Pd, Ni, V, Ta, W, Mo, Cr, Ru and Mg of 0.1 wt.% or more and 5 wt.% or less using Ag as a main component.
申请公布号 JP2002140929(A) 申请公布日期 2002.05.17
申请号 JP20000333334 申请日期 2000.10.31
申请人 FURUYA KINZOKU:KK 发明人 UENO TAKASHI;ODA NOBUHIRO
分类号 H05K1/09;C22C5/06;H01B1/02;H01B13/00;H01L21/28;H01L21/285;H01L21/3205;H01L23/52;H05K3/06;(IPC1-7):H01B1/02;H01L21/320 主分类号 H05K1/09
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