| 发明名称 |
Package for semiconductor chip having thin recess portion and thick plane portion |
| 摘要 |
In a package for mounting including a metal plate having a recess portion for mounting a semiconductor chip and a plane portion for mounting a metal pattern layer, the recess portion is thinner than the plane portion.
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| 申请公布号 |
US6379996(B1) |
申请公布日期 |
2002.04.30 |
| 申请号 |
US19990291322 |
申请日期 |
1999.04.15 |
| 申请人 |
NEC CORPORATION |
发明人 |
SUZUKI KATSUNOBU |
| 分类号 |
H01L23/12;H01L21/48;H01L23/13;H01L23/24;H01L23/31;H01L23/36;H01L23/498;(IPC1-7):H01L21/44;H01L21/50;H01L21/302;H01L21/461 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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