ELECTROPLATING METHOD USING COMBINATION OF VIBRATING FLOW AND IMPULSIVE PLATING CURRENT OF PLATING BATH

摘要

PROBLEM TO BE SOLVED: To provide a plating method which is capable of efficiently forming plating films of conductive patterns of micro-structure with good quality at a high speed without defects and the nonuniformity of the film thicknesses. SOLUTION: While vibrating flow of >=150 mm/sc in three-dimensional flow velocity is generated in a plating bath 14 by vibrating vibration vanes 16f interlocked to a vibration generating means 16d at amplitude 0.1 to 10.0 mm and number of vibration 200 to 800 times/minute within the plating bath 14, voltage is impressed between the articles X to be plated which are arranged in the plating bath 14 and have the fine micro-structures as cathodes and a metallic member 56 as an anode. The plating current flowing from the anode to the cathodes through the plating bah 14 at this time is impulsive and alternately strikes the first state to sustain the first time T1 at a first value 11 and the second state to sustain the second time T2 at a second value 12 of the same polarity as the first value. The first value 11 is >=5 times the second value 12 and the first time T1 is >=3 times the second time T2.