| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a novel semiconductor chip mounting method which can avoid a problem such as a defective connection between bump electrodes of semiconductor chips and terminal parts of a printed circuit board, in a simple step and at low cost, and also to provide a mounting sheet used for embodying the method. SOLUTION: In the method, a sheet (2) for mounting semiconductor chips having a thermosetting resin layer (2-1) of nearly the same thickness as a height of the bump electrodes is manufactured on one surface of a synthetic resin film (2-2), the rear surface of a semiconductor wafer is polished under such a condition that the sheet is pressed against the surfaces of the bump electrodes of a semiconductor wafer (1), the semiconductor wafer is diced into individual semiconductor chips (1P) with the sheet (2) being pressed thereagainst, the film (2-2) of the sheet being pressed against the surfaces of the bump electrodes of the obtained chips (1P) is peeled off therefrom, bump electrodes 1-2 of the semiconductor chip are positioned as to correctly face terminal parts 3-2 of a printed circuit board 3 and as contacted therewith and bonded to each other, the thermosetting resin 2-1 is heated and cured.</p> |
