| 摘要 |
PURPOSE: A method for fabricating a lead frame for fabricating a semiconductor package is provided to stably perform a wire bonding process, by sufficiently guaranteeing a width in a bottom portion and a top portion of a bonding region while making a lead pitch smaller. CONSTITUTION: Wire is bonded to inner leads(4). The interval between the inner leads in a region except the wire bonding region of the inner lead is defined by an etch process. The interval between the inner leads in the wire bonding region of the inner lead is cut by a laser beam and defined. |
