| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of simplifying assembling steps, area efficiency and improvement in the degrees of freedom of plan layout or improvement in breakdown voltage. SOLUTION: The semiconductor device comprises an insulating member 16, provided to cover part of a ceramic board 13 and an IGBT chip 15. The member 16 is adhered to the chip 15 with a highly insulating resin 17. The device further comprises copper plates 18-1 to 18-3 electrically separated on the member 16. These plates 18-1 to 18-3 are respectively electrically connected to a gate, an emitter and a collector regions of the chip through wire bonding. Further, the device is provided with a gate terminal 20-1, an emitter terminal 20-2 and a collector terminal 20-3. |
