| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed-wiring board that can avoid damage to components for electronic equipment when reflow treatment is made. SOLUTION: On the printed-wiring board 1, pads 3A are provided in a component-mounting section 3 for mounting the component 2 for electronic equipment. Also, around the pads 3A, a heat-reflecting surface 5 made of white ink surrounding the periphery of the component 2 of the electronic equipment is provided when the component 2 for the electronic equipment is mounted. When the reflow is carried out, the temperature in the surrounding of the component 2 for electronic equipment is maintained lower than other sections due to reflection of heat by the heat reflecting part.
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