| 摘要 |
PROBLEM TO BE SOLVED: To provide a phenolic resin for photoresist having high heat resistance, high resolution and high sensitivity. SOLUTION: The phenolic resin is a novolak type phenolic resin obtained by reacting phenols (P) comprising 30-70 wt.% m-cresol, 5-40 wt.% p-cresol and 5-50 wt.% xylenol and/or trimethylphenol with aldehydes (F) comprising formaldehyde (f1) and aromatic aldehydes (f2) in an f1 to f2 weight ratio of (1:9) to (9:1). The inertial radius (molecular size) of the novolak type phenolic resin is 1.50-2.50 nm. |
