| 摘要 |
PROBLEM TO BE SOLVED: To provide the heat dissipating structure of electronic components that has excellent heat radiation properties, and can sufficiently cope with large power. SOLUTION: Copper patterns are formed on both the surfaces of a substrate made of at least one of epoxy resin, epoxy-phenolics, and polyimide resin, an electronic component 1 is stuck onto one surface, and a heat sink 3 is stuck onto the other via an insulating sheet 7. The copper patterns on both the surfaces of the substrate are connected by a through via 4, the electronic component 1 is fixed to the heat sink 3 by a screw, and a radiation fin 6 is provided on the heat sink 3.
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