发明名称 WET TREATMENT UNIT
摘要 PROBLEM TO BE SOLVED: To provide a wet treatment unit for realizing more uniform treatment of each of a plurality of wafers under a state where the plurality of wafers are set in a containing cassette as they are. SOLUTION: A roller 13 is disposed at the bottom of a treatment bath 11 to touch the circumferential edge part of each wafer WF exposed from a containing cassette 12. Furthermore, a section 14 for driving the roller 13 to turn respective wafers WF in the containing cassette 12 is provided. The containing cassette 12 is generally provided, at the side part thereof, with grooves 121 for supporting the circumferential edge part of the wafers WF and, at the bottom part thereof, with an opening region 122. The roller 13 touches the circumferential edge part of each wafer WF set in the containing cassette 12 to turn each wafer WF.
申请公布号 JP2002093774(A) 申请公布日期 2002.03.29
申请号 JP20000278867 申请日期 2000.09.13
申请人 SEIKO EPSON CORP 发明人 ARIGA KOJI
分类号 H01L21/306;H01L21/304;(IPC1-7):H01L21/306 主分类号 H01L21/306
代理机构 代理人
主权项
地址