| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection device for semiconductor capable of making the size small with necessary strength held in a beam and forming many probes. SOLUTION: Wiring 5b is formed on one surface of the beam 11 at a specified width over the whole length of the beam 11, and thereby, the beam 11 keeps always the constant shape in the cross section in an optional direction. As a result, since a cross section secondary moment determined by the shapes of the beam 11 and the wiring 5b is made constant, even if a probe 5a comes in contact with a pad of a specimen and the beam 11 is bent by a specified amount, a problem of locally varying the curvature of the beam 11 is avoided. As a result, local stress concentration of the beam 11 is prevented, and a problem such as breakage of the beam 11 can be avoided. Accordingly, with necessary strength held in the beam, the device can be made small, and the inspection apparatus for semiconductor capable of forming many probes can be provided.
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