| 摘要 |
PROBLEM TO BE SOLVED: To provide a flip-chip coupled package that greatly saves manufacturing time, increases the heat transfer effect of a chip module, and is made of a single material. SOLUTION: A flip-chip coupled module 1 is coupled onto a substrate 11, where a tin ball 111 is provided by a flip-chip package system. In the structure, a filler 31 completely covers a projection 211. Then, the entire flip-chip coupled module 1 covered completely with an epoxy resin 41 where a high-heat- conduction and high-conductivity particle constituent such as copper, gold, aluminum, and silver is added. The epoxy resin 41 is brought directly into contact with a chip 21, thus shortening a heat conduction path, and increasing a heat exhaust function. The flip-chip coupled module 1 can be machined in a machining basis state, thus saving process and time for moving and changing a production line. |
