Cleaning method for electronic components such as circuit boards contaminated with solder paste or adhesive in production process, using dry ice particle beam

摘要

The contaminated components are irradiated with a particle beam consisting of dry ice particles. The particles preferably have a diameter of 0.01 to 1 mm. The beam may have a high particle density, and a low velocity. CO2 snow may be pressed or large dry ice particles crushed to form the particles. An independent claim is included for an apparatus for cleaning components.