| 摘要 |
PROBLEM TO BE SOLVED: To enable an insulation board to be connected at any position, facing a device frame by placing a ground pattern at any position with respect to a conductive pattern on the board surface and connecting the ground pattern to the edge of the insulation board as an exposed edge portion. SOLUTION: A printed circuit board 1 has electronic components, resistors, capacitors, etc., mounted on a conductor pattern; an exposed edge portion 11 is formed on the edge of an insulation board 2; and a ground pattern is connected to the exposed edge portion 11. A device frame 20 for mounting the printed circuit board 1 has a plurality of leaf springs 21, and so on which project toward the insulation board, to connect the exposed edge portion 11 to the device frame 20 through the leaf springs 21, and so on.
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