APPARATUS FOR POLISHING SEMICONDUCTOR DEVICE

摘要

PURPOSE: An apparatus for polishing a semiconductor device is provided to prevent a sensing error in sensing whether a wafer is absorbed to a membrane of a polishing head, by using a vacuum control unit to supply a vacuum state having a predetermined degree of vacuum to the polishing head. CONSTITUTION: The wafer is absorbed to a plurality of polishing heads in which the wafer is polished. A vacuum supply unit supplies a vacuum state to the plurality of polishing heads to make the wafer absorbed to the polishing heads. The vacuum control unit controls the degree of vacuum supplied to the plurality of polishing heads.