Electronic component device and method of manufacturing the same

摘要

An electronic component device includes a printed wiring board having a side surface terminal portion formed of a recessed groove, filler, and plating conductor. The recessed groove is formed in a side surface, or a corner adjacent to the side surface, of a board and extending from an upper surface to a lower surface. The filler fills the groove and has a plating catalytic function. The plating conductor covers an exposed surface of the filler. A method of manufacturing the electronic component device is also disclosed.