| 摘要 |
PROBLEM TO BE SOLVED: To provide the packaging method of an IC chip, that secures ultrasonic thermocompression bonding which will not damage the IC functions, and a quartz oscillator that uses the packaging meted of the IC chip. SOLUTION: A metal layer 7 for buffering is provided in a terminal electrode 4 of the IC chip 2, a bump 5 is provided on a terminal 6 of a container body 1, the IC chip 2 is stuck to the container body 1 with the minimum shock by one-time ultrasonic thermocompression and a crystal piece 3 is stuck by a conductive adhesive. |
