| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a carry pallet for semiconductor wafer in which wafers of different size can be readily dealt. SOLUTION: In the carry pallet 10 for semiconductor wafer, where a wafer 7 is contained in an opening 8 of larger size than the wafer 7 formed in a base material 1, two wire ropes 6 applied with a specified tension are provided, while spaced apart by a specified distance on the bottom face of the basic material 21 across the opening 8 in order to support the wafer 7.</p> |
