| 摘要 |
PROBLEM TO BE SOLVED: To prepare a polyphenylene sulfide film suitable as an insulating base material which is excellent in such properties for a circuit board as high frequency, low hygroscopicity, flame retardancy, solder resistance, thermal dimensional stability, hot melt workability or the like, and also to prepare a circuit board produced from the same. SOLUTION: The polyphenylene film (PPS) has a solder resistance of 260 deg.C<=, a thermal shrinkage of <=0.05 in every direction of the film at 200 deg.C for 5 minutes, a dimensional change ratio of <=1% in every direction of the film by using TMA, when temperature is increased from a room temperature to 200 deg.C and is again lowered to the room temperature and a small endothermic peak (Tmeta) appeared before the melting of a crystal in the range between >=(Tm-80) deg.C and <= a melting point (Tm) by a differential scanning calorimetry(DSC). |
