发明名称 METHOD FOR MANUFACTURING PARTICLE BOARD, AND PARTICLE BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a particle board capable of having a sufficient strength and dimensional stability, and the particle board. SOLUTION: Wood chips are impregnated with a binder to improve a strength of the chip themselves, and rigidly bonded among the chips to each other to improve a strength of the particle board. Since a water absorption ratio of the chips is suppressed by impregnating the chips with the binder, its swelling rate is suppressed to improve dimensional stability. Further, as the binder, a phenol resin is sued, and the board having a higher strength and excellent dimensional stability is manufactured. The chips are hot press molded by a high pressure hot press, the board having a high density surface part and a low intermediate part is manufactured. The board having a predetermined strength and dimensional stability can be obtained by this method.
申请公布号 JP2002018820(A) 申请公布日期 2002.01.22
申请号 JP20000202507 申请日期 2000.07.04
申请人 MISAWA HOMES CO LTD 发明人 ABIKO HARUHIKO
分类号 B27N1/02;B27N3/06;(IPC1-7):B27N1/02 主分类号 B27N1/02
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